Low Pressure Molding (LPM)
Low pressure molding - a more eco-friendly process option
Materials of low pressure molding, also known as hot melt adhesive, it is not PVC but a special PA-based engineering plastic. It is sustainable, halogen-free, non-toxic, and corrosion-resistant. Meanwhile, it offers high fluidity, low water absorption, well-sealed, and low injecting pressure. Therefore, it must be produced with a dedicated low pressure molding machine, not suitable for traditional plastic injection machines.
Advantages of low pressure molding - waterproof protect components
Low pressure molding is an encapsulation process by injecting plastic materials into molds with very low pressure. It can quickly solidify to achieve insulation, temperature resistance, impact resistance, vibration reduction, moisture proof, waterproof, dustproof, and chemical corrosion resistance. This is a suitable product encapsulation application to replace the Epoxy filling/dispensing process for protecting fragile electronic components. By using soft, low-pressure hot-melt adhesive to encapsulate cables and connectors, LPM offers a more tightly sealed effect than previous pressure-free potting. It would not damage components easily and widely applied in PCB encapsulation, waterproof connectors, cables packaging, sensors, and other products in the automotive, industrial, and many other fields.Low pressure molding is also different from general plastic mold design, which includes product design, metal selection, glue feeding method, runner, mold flow, and exhaust. All of those must be adjusted according to the low-pressure raw materials of various materials.
Traditional glue potting vs low pressure injection molding steps
Compared with traditional glue potting, low pressure molding requires shorter time and simpler steps. Glue potting generally takes 24 hours on average or even longer, but low pressure injection only takes 45-60 seconds to complete curing. Glue potting requires 8 steps and more space to wait for solidification. Low pressure molding requires only 3 simple steps.Low Pressure Injection Molding 3 Steps
Traditional Potting Steps
Traditional Potting Steps
The advantages of COMOSS Low Pressure Molding (LPM) Service
FEATURES
- IP67 dustproof/waterproof
- Environmental protection
- High/low temperature resistance
- Chemical resistance
- Impact-resistant property
- Insulation
- Dampproof
APPLICATIONS
- IPC Industry- Industrial control、PCB encapsulation、Cable connector
- Industrial Equipment Industry- Proximity switch、Cable connector、Coil、Motor
- Automotive Industry- TPMS、Sensor、Power socket、Circuit board、Motor、Meter
Read More:
A Guide to Choose Low Pressure Molding (LPM) Service Provider: Experienced in the Industry and Projects Is the KeyThe Best Waterproof And Impact Resistance Solution for Electronic Components: Low Pressure Molding
How Does The Low Pressure Molding Protect Electronics- Materials
Why Choosing Low Pressure Molding? Comparing to High Pressure Injection Molding
Successful Case: How Does Low Pressure Molding Add Values To Your Manufacturing Process
Succrssful Case: How Low Pressure Molding Turn-Key Solution Helps To Stabilize Production Quality & Manage Emergent Orders
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Or email us at sales@comoss.com
You can also call us directly at: +886 2 2688 2498
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General Specifications
| Ejection type | Melt capacity | Injection volume | Glue pump rotation | Nozzle trip | Nozzle force | |
|---|---|---|---|---|---|---|
| Horizontal ejection | 3.5 L | 8.98 cm3/r | 0~100 r.p.m | 50 mm | 0.06 ton |
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