Why Choosing Low Pressure Molding? Comparing to High Pressure Injection Molding

Developed in the 1970s, low pressure molding (LPM) was introduced to solve the electronic components protection issues in the automotive industry.  Nowadays, with the electronic components widely applied in all aspects of industry more than ever, the LPM process is being adopted in various fields, such as industrial, military, medical, electronic vehicle, outdoor electronics, lighting, and consumer electronics. It can achieve exceptional protection and insulation of mechanical and electrical components with higher productivity.

The basic materials of LPM are polyamide and polyolefin, which are eco-friendly and can be melted again and reused.
 

The differences between low pressure molding (LPM) and high-pressure injection molding (HPM)

The low pressure molding (LPM) technology does not stress delicate electronic components or solder joint components on the PCB. Overmolded and sealed by low pressure, LPM gives environmental protection from EMI, humidity, dust, vibration, and temperature.  The relatively low injection temperature of LPM has less impact on sensitive electronic components.

Additionally, both steel and aluminum can be applied as the tooling material of LPM. It offers more cost-effectiveness in the tooling and flexibility in the choice of mold material than high-pressure injection molding. 

The high pressure from traditional molding may damage or impact sensitive electronic components. Yet,  it benefits from faster cycle time, that its productivity more efficient. It fits the products for high volume and with non-sensitive parts.  

Customerized cable solutions and electronic mechanical design for harsh environments would be more suitable for utilizing LPM to encapsulate the sensitive components. LPM gives better protection for the electronic components from the impact of a harsh environment.