Harsh Environment Solution
The components, devices, or machines applied in Industries, military, medical, marine, and outdoor are in various harsh environments. The connectivity, components, modules, and devices are required to withstand vibration, movement, electronic noise, stress, temperature, and moisture.
How does COMOSS add value to your performance?
To bear the harsh environment, the connectivity and mechanism are designed to fit the environment.
- Overmold design
- Vibration resistance
- EMI shield
- Temperature resistance
- Moisture and dust resistant, IP67, industrial grade
- Stress dissipation
- High flex
- Sensitive component protection
Send us your inquiry to know more about "Harsh Environment Solution"！
Cable
A transmission cable often consists of wires and connectors, while the wire usually delivers a signal between devices and the connectors contact the device. The connection section is the weakest part of the cable structure, which is easily damaged. COMOSS’s mechanical design reinforces the strength of the connection in the connector seal, contact, and jacket over molds, strain reliefs, bushing, and grommets. The advanced manufacturing process and validation tests ensure the cable meets the individual environmental demand to dissipate stress and vibration or to resist moisture, chemicals, or EMI.
Some cables are used in motion systems. The cable needs to bear the force impact of the motion system, such as torsion, winding, and bending. COMOSS’s cable provides high flexibility and elasticity with dissipating stress design in a mechanism that has been applied by machine vision industry users.
Sensitive Electronic Components
The fragile component is required for environmental protection. Traditional injection molding sometimes damages delicate components because of its high-temperature process. Epoxy potting takes more steps and a longer cycle time, sometimes a working day. The efficiency of its environmental protection is not as effective as low pressure molding (LPM). Relatively low temperature, it takes only 3 steps in the process and completes an overmold in around 20 – 45 seconds.
Low pressure molding solution is suggested by IPC to encapsulate circuitry as well as sensors in a cost-effective way to protect the sensitive components. One of COMOSS's solutions for harsh environments is the LPM solution. From cable structure to electronic components and modules, the solution provides insulation and protects the products.
