COMOSS LPM Service Featured on “基板の窓口”, a Japanese PCB Industry Information Platform
COMOSS Low Pressure Molding (LPM) service has been featured since May on “基板の窓口”, a Japanese information platform for the electronic PCB industry. Through this article, readers can learn how the characteristics of the low pressure molding process provide excellent protection for precision electronic components.
COMOSS has also provided customized LPM services for customers across various industries, with applications including sensor PCB encapsulation and protection, marine and outdoor construction equipment, motherboard and critical component protection, and PCB encapsulation.
The material used in the low pressure molding process is an eco-friendly hot-melt adhesive based on Polyamide (PA), featuring halogen-free, non-toxic, and corrosion-resistant properties. By encapsulating precision electronic components through low pressure injection, the process requires only three molding steps and can cure within 45-60 seconds compared with traditional potting. Low pressure molding is also reworkable and can be designed according to the required product structure, offering greater manufacturing flexibility and reducing process risks. Finished products can achieve a waterproof and dustproof rating of IP67 or above, with excellent impact resistance, vibration resistance, moisture resistance, high and low temperature resistance, and chemical resistance.
COMOSS’s professional engineering team provides one-stop services from product evaluation, encapsulation design, mold development, and LPM molding to final testing, helping customers create more stable and durable protection solutions for electronic products.
The full article on COMOSS Low Pressure Molding service is available on our blog:
Need Waterproof and Impact-resistant Protection for Your Electronic Components? COMOSS Offers Low Pressure Molding Services with Design Support
This article is also published in Japanese on 基板の窓口
COMOSS has also provided customized LPM services for customers across various industries, with applications including sensor PCB encapsulation and protection, marine and outdoor construction equipment, motherboard and critical component protection, and PCB encapsulation.
The material used in the low pressure molding process is an eco-friendly hot-melt adhesive based on Polyamide (PA), featuring halogen-free, non-toxic, and corrosion-resistant properties. By encapsulating precision electronic components through low pressure injection, the process requires only three molding steps and can cure within 45-60 seconds compared with traditional potting. Low pressure molding is also reworkable and can be designed according to the required product structure, offering greater manufacturing flexibility and reducing process risks. Finished products can achieve a waterproof and dustproof rating of IP67 or above, with excellent impact resistance, vibration resistance, moisture resistance, high and low temperature resistance, and chemical resistance.
COMOSS’s professional engineering team provides one-stop services from product evaluation, encapsulation design, mold development, and LPM molding to final testing, helping customers create more stable and durable protection solutions for electronic products.
The full article on COMOSS Low Pressure Molding service is available on our blog:
Need Waterproof and Impact-resistant Protection for Your Electronic Components? COMOSS Offers Low Pressure Molding Services with Design Support
This article is also published in Japanese on 基板の窓口