Low Pressure Process

Low pressure material is also commonly known as hot melt adhesive, this material is not PVC but special engineering plastics based on PA, environmental protection halogen-free, non-toxic and anti-corrosion, high fluidity, low water absorption, good sealing, low molding pressure, so it is not suitable for the traditional plastic injection machine to use, so it must be produced by a special low pressure molding machine.

Low pressure injection molding is a very low injection pressure to the encapsulation material injection mold and the encapsulation technology of the rapid curing method, to achieve insulation, heat resistance, impact resistance, anti-vibration, moisture-proof, waterproof, dustproof, resistance to chemical corrosion, etc, applies to the product injection package, replace Epoxy perfusion/dispensing process to protect vulnerable electronic components, and encapsulation of the soft low pressure hot melt adhesive material wire connector pressure perfusion way more closed than ever, and do not damage components.

It is also different from the general plastic mold design, such as product design, steel selection, glue feeding way, flow channel, mold flow, exhaust need to be adjusted according to a variety of different materials of low pressure raw materials. 

                                             Epoxy Potting

Potting takes longer cycle time, 24 hours in average, while low-pressure-molding (LPM) process takes around 20 - 45 seconds to complete molding.  Additionally, it takes 8 steps to complete the process and more spaces for curing when LPM completes the whole process in 3 steps.

Potting steps
Potting steps
 

low-pressure-injection-molding steps
    Low-pressure-injection-molding steps
  

FEATURES

  • IP67 dustproof/waterproof
  • Environmental protection
  • High/low temperature resistance
  • Chemical resistance
  • Impact resistant property
  • Insulation
  • Dampproof

APPLICATIONS

  • IPC Industry 
    -Industrial control 
    -PCBA 
    -Cable connector 
  • Industrial Equipment Industry 
    -Proximity switch 
    -Cable connector 
    -Coil 
    -Motor 
  • Automotive Industry 
    -TPMS 
    -Sensor 
    -Power socket 
    -Circuit board 
    -Motor 
    -Meter 
  • Low Pressure Process feature
  • Low Pressure Process feature
  • Low Pressure Process feature
General Specifications
Ejection type Melt capacity Injection volume Glue pump rotation Nozzle trip Nozzle force
Horizontal ejection 3.5 L 8.98 cm3/r 0~100 r.p.m 50 mm 0.06 ton

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