Why Choosing Low Pressure Molding? Comparing to High Pressure Injection Molding


Developed in 1970’s, low pressure molding (LPM) was introduced to solve the electronic components protection issues in automotive industry.  Nowadays, with the electronic components are wildly applicaing in all aspects of the industries than ever, The LPM process is adopting in various fields, such as the industrial, military, medical, electronic vehicle, outdoor electronic, lighting, and consumer electronics. It can achieves exceptional protection and insulation of mechanical and electrical components with higher productivity.

The basic materials of LPM are polyamide and polyolefin that are eco-friendly can be melted again and be reusable.

The differences between low pressure molding (LPM) and high pressure injection molding (HPM)



The low pressure molding (LPM) technology does not stress delicate electronic components or solder joint components on PCB. Overmolded and sealed by low pressure, LPM gives environmental protection from EMI, humidity, dust, vibration, and temperature.  The relatively low injection temperature of LPM has less impact on sensitive electronic components.

Additionally, both steel and aluminum can be applied as the tooling material of LPM. It offers more cost effective on the tooling and flexibility on the choosing of mold material than high pressure injection molding. 

The high pressure from traditional molding may damage or impact sensitive electronic components. Yet,  it benefits on faster cycle time that its productivity is more efficient. It fits the products for high volume and with not sensitive parts.  

Customerized cable solutions and electronic mechanical design for harsh environments would be more suitable utilizing LPM to encapsulate the sensitive components. LPM gives a better protection for the electronic components from the impact of harsh environment.

  • Low Pressure Molding (LPM)

    Low Pressure Molding (LPM)