How Does The Low Pressure Molding Protect Electronics:Materials

 

Low pressure molding – An eco-friendly process option

The base material of low-pressure molding (LPM) is polyamide (also known as PA), also commonly known as hot melt adhesive. This material is not PVC but a special PA-based engineering plastic. It extracted from 75% vegetable oil, can be broken down and reused. It is eco-friendly, halogen-free, non-toxic, anti-corrosion, high fluidity, low water absorption, good sealing, and low molding pressure. It must be produced with a dedicated low-pressure molding machine.
 

The physical properties

  • Its molecular-chain structure has much a loose structure than the engineering-plastic one which is much complicated. It reaches a liquid-flow form at 200⁰C in average while the engineering plastics need at least 280⁰C to reach the liquid-flow form with screw preplastication to heat the temperature and loose the structure.
  • The shrinkage is around 1% - 1.5%. The formed dimensions are relatively stable and reach engineering-plastic requested stability.
  • Low-pressure molding requests less compounds than some of engineering plastics. Because its specific gravity is around 0.98 – 1 (compound density/ water density ratio).
  • In terms of hardness, the material is classified as flexible plastics and its hardness also reach to Sore D 70.
  • It has a good performance in weather resistance and reach UL flammability standard-Plastic UL94V0. Additionally, the compounds characterize age resistant, temperature resistant (150⁰C), oil resistant, salt resistant etc.
  • The aspect of water resistance, the compound performs well in adhesion and viscosity. It has the encapsulation reach to IP67. With the improvement of mechanical design, it can reach to IP68.
  • Low Pressure Molding (LPM)

    Low Pressure Molding (LPM)