How Does The Low Pressure Injection Molding Protect Electronics- Materials

The low-pressure molding materials consist of thermoplastic polyamide as a base and 75% of compounds extracted from vegetable oil. The compound is reusable and eco-friendly. Its molecular-chain structure has much a loose structure than the engineering-plastic one which is much complicated. It reaches a liquid-flow form at 200⁰C in average while the engineering plastics need at least 280⁰C to reach the liquid-flow form with screw preplastication to heat the temperature and loose the structure.

The shrinkage is around 1% - 1.5%. The formed dimensions are relatively stable and reach engineering-plastic requested stability.

Low-pressure molding requests less compounds than some of engineering plastics. Because its specific gravity is around 0.98 – 1 (compound density/ water density ratio).

In terms of hardness, the material is classified as flexible plastics and its hardness also reach to Sore D 70. It has a good performance in weather resistance and reach UL flammability standard-Plastic UL94V0. Additionally, the compounds characterize age resistant, temperature resistant (150⁰C), oil resistant, salt resistant etc.
The aspect of water resistance, the compound performs well in adhesion and viscosity. It has the encapsulation reach to IP67. With the improvement of mechanical design, it can reach to IP68.