Low Pressure Molding (LPM)

Low pressure molding - a more eco-friendly process option
Materials of low pressure molding as known as hot melt adhesive; it is not PVC but a special PA based engineering plastic. It is sustainable, halogen-free, non-toxic, and corrosion-resistant. Meanwhile, it offers high fluidity, low water absorption, well-sealed and low injecting pressure. Therefore, it must be produced with dedicated low pressure molding machine, not suitable for traditional plastic injection machines.


Advantages of low pressure molding - waterproof & protect components
Low pressure molding is an encapsulation process by injecting plastic materials into molds with very low pressure. It can quickly solidify to achieve insulation, temperature resistance, impact resistance, vibration reduction, moisture proof, waterproof, dustproof, and chemical corrosion resistance. This is a suitable product encapsulation application to replaces Epoxy filling/dispensing process for protecting fragile electronic components. By using soft low-pressure hot-melt adhesive to encapsulate cables and connectors, LPM offers more tightly sealed effect than previous pressure free potting. It would not damage components easily and widely apply in PCB encapsulation, waterproof connectors, cables packaging, sensors, and other products in the automotive, industrial and many other fields.

Low pressure molding is also different from general plastic mold design, which is including in product design, metal selection, glue feeding method, runner, mold flow, exhaust, all of those must be adjusted according to the low pressure raw materials of various materials.





Traditional glue potting vs low pressure injection molding steps
Compared with traditional glue potting, low pressure molding requires shorter time and simpler steps. Glue potting generally takes 24 hours averagely or even longer, but low pressure injection only takes 45-60 seconds to complete curing. Glue potting requires 8 steps and more space to wait for solidification. Low pressure molding requires only 3 simple steps.

Click here to send us an inquiry to learn more about how "low pressure molding" can better replace traditional glue potting. Or, email us: sales@comoss.com

Low Pressure Injection Molding 3 Steps




Traditional Potting steps

The adventages of COMOSS Low Pressure Molding (LPM) Service

1.  Stable manufacturing = Ensured the production quality
2.  Experience in the cable and connector molding = providing exclusive production solution
3.  Extensive industry experiences = Total solution one-stop service

FEATURES
1. IP67 dustproof/waterproof
2. Environmental protection
3. High/low temperature resistance
4. Chemical resistance
5. Impact resistant property
6. Insulation
7. Dampproof

APPLICATIONS
- IPC Industry- Industrial control、PCB encapsulation、Cable connector
- Industrial Equipment Industry- Proximity switch、Cable connector、Coil、Motor
- Automotive Industry- TPMS、Sensor、Power socket、Circuit board、Motor、Meter 


Read More about Low Pressure Molding:

The Best Waterproof And Impact Resistance Solution for Electronic Components: Low Pressure Molding
How Does The Low Pressure Molding Protect Electronics- Materials
Why Choosing Low Pressure Molding? Comparing to High Pressure Injection Molding
Successful Case: How Does Low Pressure Molding Add Values To Your Manufacturing Process?

General Specifications
Ejection type Melt capacity Injection volume Glue pump rotation Nozzle trip Nozzle force
Horizontal ejection 3.5 L 8.98 cm3/r 0~100 r.p.m 50 mm 0.06 ton

Customized Service

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