PRODUCTS SPECIFICATION
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DESCRIPTION CUSTOMER COMOSS P/N |
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Edge Card Connector 3.96mm Pitch
ES Series |
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Date of Issue |
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08-Nov-2001 |
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Version |
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1.4 |
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Designer |
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James |
昕鈺實業股份有限公司COMOSS ELECTRONIC CO.,LTD.
4F.,No.11,Chung-Hsin st.,Shulin 238,Taipei,Taiwan R.O.C.
TEL：+886 2 2688-2498 FAX：+886 2 2689-9160
附件二 表單編號：CQP-RD-009-4
COMOSS ELECTRONIC CO., LTD.
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Approved : |
File No. |
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M-03 |
1.4 |
1 OF 4 |
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Subject : Product Specification - Edge Card Connector 3.96mm Pitch (DIP Solder & Press Fit.) |
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1.0 General
This specification covers the 5.08mm / .200" center on 3.96mm / .156" grid, Edge Card family applicable for thickness 1.6 +/- 0.2mm Slot PCB and for max. thickness 2.4mm Main PCB.
ES - D XX S 30 B 0 (1) (2) (3) (4) (5) (6) (7)
* 30 : 30 u" gold
4.0 Overall Dimensions See attachment. |
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File No. |
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M-03 |
1.4 |
2 OF 4 |
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Subject : Product Specification - Edge Card Connector 3.96mm Pitch (DIP Solder & Press Fit.) |
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5.0 Electrical performance |
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Item |
Description |
Test methods and Condition |
Requirements |
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5-1 |
Rated Voltage |
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250V (ac/dc) |
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5-2 |
Rated Current |
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5Amp (ac/dc) |
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5-3 |
Termination Resistance |
EIA 364-23A Subject mated contacts measured by 20mV maximum open circuit at 10mA. |
10m Ohm Maximum. |
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5-4 |
Insulation Resistance |
EIA 364-21C Test between adjacent contacts. |
5000M Ohm Minimum. |
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5-5 |
Dielectric Withstanding Voltage |
EIA 364-20B Test between adjacent contacts. 1800Vac for 1 minutes. |
No Breakdown. |
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Approved : |
File No. |
Rev. No. |
Page |
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M-03 |
1.4 |
3 OF 4 |
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Subject : Product Specification - Edge Card Connector 3.96mm Pitch (DIP Solder & Press Fit.) |
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6.0 Mechanical performance |
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Item |
Description |
Test methods and Condition |
Requirements |
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6-1 |
Board Insertion Force (Single contacts pair) |
EIA 364-13B Measure force necessary to mate connector at rate of 2.5mm per Sec. Use test gauge t=1.8 +/-0.05mm |
450g maximum. |
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6-2 |
Board Extract Force (Single contacts pair) |
EIA 364-13B Measure force necessary to unmate connector at rate of 2.5mm per Sec. Use test gauge t=1.4 +/-0.05mm |
30g minimum. |
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6-3 |
Retention Force |
EIA 364-29B At a rate of 2.5mm per sec. |
1.8 kg min. |
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6-4 |
Pin Insertion Force |
Westell Doc# EC-117 At a rate of 2.5mm per sec.
Use PCB hole plate |
20.5kg Max.
(For press-fit only) |
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6-5 |
Pin Removal Force |
Westell Doc# EC-117 At a rate of 2.5mm per sec.
Use PCB hole plate |
3.4 kg Min. 20.5kg Max.
(For press-fit only) |
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6-5 |
Normal Force |
EIA 364-04 |
No less than100 g |
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COMOSS ELECTRONIC CO., LTD.2F , 25 San Chun St., Shulin 23805 , Taipei, Taiwan, R.O.C. Tel : 886-2-26896282(Rep.) Fax : 886-2-26896557
Approved : File No. Rev. No. Page
M-03 1.4 4 OF 4
Subject :
Product Specification - Edge Card Connector 3.96mm Pitch (DIP Solder & Press Fit.)
7.0 Solderability (Continued)
Solder Temperature : 245 +/- 5 ℃
EIA 364-52 (For DIP solder only)
Heat surface of the PCB.
The dwell time shall be 10 +/- 2 Sec.
EIA 364-56A
(For DIP solder only)
8.0 Environmental performance
Item Description Test methods and Condition Requirements
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8-1 |
Durability |
When mated up to 200 cycles repeatedly |
Contact Resistance must be less than 30mΩ Normal force must be no less than |
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100g |
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8-2 |
Temperature Life |
105 +/- 3 ℃, 250 hours. |
Appearance : No damage Contact Resistance : +/- 20m Ohm change. |
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EIA 364-17B |
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8-3 |
Humidity - Cycling Temperature |
4 cycles, between 25℃ and 65 ℃ at 90% relative -humidity. |
Appearance : No damage Contact Resistance : +/- 20m Ohm change. |
2). -55 ℃ 30 min. Contact Resistance : Max. 20m Ohm
change.
EIA 364-32C
from the 5 +/- 1% solution at Contact Resistance : Max. 20m Ohm 35 +/- 2 ℃. change.
EIA 364-26B
